WHAT DOES PCB STAND FOR CODE
The price for one unit of the delivery format chosen in the calculator.Ī protective layer of liquid photo image able lacquer applied on the TOP and BOTTOM side of a Printed Circuit Board.Ĭustomer specific markings such as logo, name, date code etc… The edge of the board is plated with copper and then the final finish such as HAL.Īn electrical connection between two or more nets or isolated points that should not be connected. Holes designed for the press fit of component leads, usually connectors.
WHAT DOES PCB STAND FOR FREE
Prepreg or Unprocessed Copper Free Base Material Plating Simulation – our New Tool for PCB DesignersĪn unpressed base material without any copper foil. Plated through holes in the edge of the board. The diameter of the Tool used in production to drill the hole. PCB separation method – on a Customer PanelĪlso know as Peel-off Mask is a protective coating that can be easily removed. Pre-cut the boards in a Customer Panel for easy removal after assembly. Printed Circuit Board (also know as “the board”). The PCB Spacing defines the extra space you want between different PCB’s on the Customer Panel. The required contour of a Customer Panel. The Outer Layer(s) of the PCB either the TOP or BOTTOM side.Įxtra material around your PCB or multiple PCB’s to form a Customer Panel.Ī Panel where defective PCB’s have been visually crossed out. The total delivered PCB surface area of your order expressed in dm². Used to form the contour of the PCB’s or Panels.Ī discontinuity or non-connection within a net. Suggestions for Naming Your CAD-Data-Filesįinal finish applied to the soldering areas of the PCB to prevent oxidation and to them easier to solder.Ī type of short, sometimes referred to as a high-resistance short. The number of holes per dm² of the board surface. How Often Can You Raise a Eurocircuits PCB to Lead-free Soldering TemperatureĪ paste used too fill Via Holes that are designed for Thermal dissipation. The finished hole size or ENDHOLE is the diameter that the PCB designer specifies in his PCB layout.įiberglass reinforced epoxy laminates that are Flame Retardant.įibreglass Reinforced – Flame Retardant Base Material When producing multilayers with Blind and Buried Via Holes, the panel may need to pass through the galvanic Plating process multiple times. When producing Multi-layers with Blind and Buried Via Holes, additional Press Cycles may be required. Reduce the square edge of the connector to a sloping edge to ease entry in to the socket.Ī layer of gold plated to the fingers of the Edge Connector. PCB’s or Customer Panels that have the necessary Tooling Holes to be used with the Eurocircuits eC-stencil-mate or eC-stencil-fix equipment. Removing a specific area of the Outer Layer of the PCB to a specific depth. Guidelines for customers that opt for the Eurocircuits standard panel The method in which you ask Eurocircuits to produce and delivery your PCB design.
PCB Multilayer Fabrication – Lay-up and BondĬu is the chemical abbreviation for Copper Soldermask on via-holes in case of chemical Nickel-Gold surface finishĬopper Foils is the base copper thickness applied on OUTER and INNER layers.Ĭopper is placed up to the very edge of the Board Contour.Ī rigid base material laminate with copper on one or two sides.Ĭore or Rigid Copper Laminated Base Material The thickness given in mm based on the base materials used including copper foil.ĭefined build of a PCB such as number of layers an their sequence.Ĭarbon Ink normally used for keyboard contacts, LCD contacts and jumpers.ĬHAMFERED MECHANICAL or COUNTERSUNK HOLESĪ beveled edge of a holes usually at 45 degrees.Ĭhamfered Mechanical Holes or Countersunk HolesĮNIG, Electro less Nickel Immersion Gold, also called Che Ni/Au, chemical nickel gold or also known as soft gold.Ĭh Ni/Au or ENIG (Electroless Nickel Immersion Gold) The price includes the price for the PCB’s selected in the calculator
A Buried Via connects two or more Inner Layers but does not go through to an Outer Layer. Electrical Testing of the non-populated PCB.Ī Blind Via connects an Outer Layer to one or more Inner Layers but does not go through the entire board.